Key Features
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Band-specific design for optimized performance 
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High gain for strong signal amplification 
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Excellent linearity minimizes signal distortion 
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Compact and efficient hybrid IC package 
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Internally matched input and output ports 
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Wide voltage operating range 
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Integrated thermal protection circuitry 
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Rugged design for harsh environments 
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Ideal for LTE, 5G, and RF systems 
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Supports spectral emission compliance 

 
								
 
	 
	 
	