GX3700e Specifications
External Digital I/O Channels | |
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Logic Families | LVTTL, LVDS, configurable for 1.2 / 2.5 / 3.3 V logic; 5 V compatible |
Output Current | ±4.0 mA |
Input Leakage Current | ±10 µA |
Power on State | Default is disconnect at power on (unprogrammed FPGA) or defined by FPGA program |
Number of Channels (External Interface) | 160 I/O signals, single ended, direction is configurable on a per channel basis Up to 64 I/O can be differential (32 differential channels) (4) I/O are single-ended or (2) differential clock inputs |
Protection | Overvoltage: -0.5 V to 7.0 V (input) Short circuit: up to 8 outputs may be shorted at a time |
I/O Connector | (4) SCSI III, VHDCI type, 68 pin female |
Expansion Board Interface | |
Board ID | 4 bits |
Digital I/O Interface | 160 I/O, signals, single ended, direction is configurable on a per channel basis Up to 64 I/O can be differential (32 differential channels) (4) I/O are single-ended or (2) differential clock inputs |
Master Clear | From PXIe interface |
Power | ±12 V, +5 V, +3.3 V, +2.5 V, +1.2 V |
Timing Sources | |
PXIe Bus | 10 MHz, 100 MHz |
Internal | 80 MHz oscillator, ±20 ppm |
FPGA and Memory | |
FPGA Type | Altera Stratix III, EP3SL50F780 |
Number of PLLs | Four |
Logic Elements | 47.5 k |
Internal Memory | 2.133 kb |
On-Board Memory | 256 k x 32 SSRAM |
On-Board Flash | 16 MB |
Power | |
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3.3 VDC | 3.6 A (typ); 4.9 A (max) |
5 VDC | 0.035 A (typ); 0.04 A (max) |
12 VDC (For Expansion Board) |
Expansion board dependent |
Environmental | |
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Operating Temperature | 0 °C to +50 °C |
Storage Temperature | -20 °C to +70 °C |
Size | 3U PXI |
Weight | 200 g |
Note: Specifications are subject to change without notice.